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Redefine Innovation Workshop P2 - 半導體先進封裝製程
Chapter 1 - Future Trends & 2.5D Packaging
Future Trends & 2.5D Packaging製程解析 (61:34)
Q&A (17:15)
Chapter 2 - 3D Packaging
3D Packaging製程解析 (38:41)
3D Packaging Q&A (11:26)
Chapter 3 - 2D Packaging, CPO, FOPLP & SoW-X
2D Packaging, CPO, FOPLP & SoW-X製程解析 (57:52)
Final Q&A (13:35)
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Future Trends & 2.5D Packaging製程解析
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